PCB¯S¥Î¤Æ¾Ç«~«¬¿ý |
No. |
²£¡@«~ |
Ãþ¡@«¬ |
¤j¡@¤p |
¤U¡@¸ü |
¡@ |
«í§QªÖ¦³¤½¥q²£«~¥Ø¿ý(new) |
Word |
45.5KB |
|
105 |
¤Æ¾Ç¿üElectroless Solder |
PDF |
108KB |
|
130 |
®øªw¾¯(Deformer) |
PDF |
87KB |
|
132 |
³æ²G²M¼Ñ¾¯ |
PDF |
107KB |
|
133 |
Åã¼v¼Ñ²M¼ä¾¯ |
PDF |
117KB |
|
133-2 |
Åã¼v¬~¼Ñ¾¯ |
PDF |
140KB |
|
136 |
«Dª¿®øªw¾¯(Non-Si Deformer) |
PDF |
87KB |
|
145 |
¬¡¤Æ§í¨î¾¯(Activate Inhibitor) |
PDF |
117KB |
|
147 |
»É§Ü®ñ¤Æ¾¯(Anti-Tarnish) |
PDF |
95KB |
|
151 |
¶W²Ê¤Æ¾¯ |
PDF |
133KB |
|
155 |
°h¿ü¤ô |
PDF |
87KB |
|
157 |
ª÷Åܦâ³B²z¾¯ |
PDF |
89KB |
|
160 |
»Éºä²M¼ä¾¯ |
PDF |
138KB |
|
185 |
°h¾¥²G |
PDF |
110KB |
|
188 |
¨¾²k°h¬~²G |
PDF |
112KB |
|
201 |
ºÒ»Ä¹[Åã¼v¾¯ |
PDF |
139KB |
|
211 |
Å@»É¾¯ |
PDF |
87KB |
|
213 |
¿ü¹]«OÅ@¾¯ |
PDF |
91KB |
|
233 |
·L»k¦w©w¾¯ |
PDF |
97KB |
|
250 |
»Ä©Ê»k¨è²G |
PDF |
186KB |
|
269 |
¥þ¤ô·»©Ê¼Q¿ü§U²k¾¯ |
PDF |
122KB |
|
310 |
éª÷¾¯ |
PDF |
103KB |
|
350 |
¤Æ¾Ç¿ü |
PDF |
138KB |
|
370 |
éÂ쾯 |
PDF |
99KB |
|
370NI |
éÂ쾯 |
PDF |
113KB |
|
510 |
»Ä©Ê²M¼ä¾¯(Acid Cleaner) |
PDF |
98KB |
|
520 |
»Ä©ÊÁá»É¥ú¿A¾¯(Acid Copper) |
PDF |
240KB |
|
520C |
°ª¿@«×»Ä©ÊÁá»É¥ú¿A(AcidCopper) |
PDF |
227KB |
|
525 |
»Ä©ÊÁá»É¥ú¿A¾¯ |
PDF |
205KB |
|
528 |
¦³¾÷»Ä¥ú¿A¯Â¿ü |
PDF |
126KB |
|
530 |
¦³¾÷»Ä¿ü¹]²K¥[¾¯(Organic Solder) |
PDF |
209KB |
|
531 |
¯Â¿üOrganic Pure-Tin |
PDF |
110KB |
|
533 |
®ø¤Æ³J¥ÕPeptone |
PDF |
109KB |
|
550 |
¯Â¿üPure-Tin |
PDF |
92KB |
|
B0-610 |
ÄЩʲM¼ä¾¯(Alkaline Cleaner) |
PDF |
92KB |
|
B0-620 |
¹w®û¾¯ |
PDF |
125KB |
|
BO-630 |
´Ä¤Æ¾¯HC Bond |
PDF |
142KB |
|
BX-710 |
ÆP©Ê²M¼ä¾¯(Alkaline Cleaner) |
PDF |
115KB |
|
BX-720 |
·L»k¦w©w¾¯(Micro-Etching) |
PDF |
97KB |
|
BX-730 |
¹w®û¾¯(Pre-Dip) |
PDF |
92KB |
|
BX-750 |
¶Â®ñ¤Æ¾¯(Oxide) |
PDF |
134KB |
|
BX-770 |
ÁÙ쾯(Reducer) |
PDF |
92KB |
|
D-810 |
¿±ÃP¾¯(Sweller) |
PDF |
90KB |
|
D-820 |
°£½¦´í¾¯(Promoter) |
PDF |
93KB |
|
D-830 |
¤¤©M¾¯(Neutralizer) |
PDF |
89KB |
|
P-840 |
²æ¯×¥¾ã¾¯(Conditioner) |
PDF |
125KB |
|
P-846 |
¥¾ã¾¯(Conditioner) |
PDF |
99KB |
|
P-850 |
¹w®û¾¯(Pre-Catalyst) |
PDF |
94KB |
|
P-856&P-866 |
¹w®û¾¯ P-856 A/B ¬¡¤Æ¾¯P-866 |
PDF |
119KB |
|
P-860 |
¬¡¤Æ¾¯(Catalyst) |
PDF |
117KB |
|
P-870 |
¥[³t¾¯(Accelerator) |
PDF |
105KB |
|
P-876 |
³t¤Æ¾¯ A/B |
PDF |
94KB |
|
P-880 |
¤Æ¾Ç»ÉElectroless Cu |
PDF |
104KB |
|
P-886 |
¤Æ¾Ç»É M/A/B |
PDF |
145KB |
|
930 |
¦³¾÷«OÅ@²k¾¯¡]OSP¡^ |
PDF |
137KB |
|
HC-269 |
¥þ¤ô·»©Ê¼Q¿ü§U²k¾¯ |
PDF |
160KB |
|
HC Desmear |
Desmear Process
°£½¦´í»sµ{ |
PowerPoint |
103KB |
|
HC BOND |
HCBOND
¤º¼h¶Â´Ä¤Æ¨ú¥N»sµ{ |
PowerPoint |
1.42MB |
|
HCOXIDE1 |
¶Â¤Æ²¤¶HCOXIDE |
PowerPoint |
1.18MB |
|
PTH Process |
PTH Process
Áá³q¤Õ»sµ{ |
PowerPoint |
193KB |
|
¡@ |
Ni-1¥b¥úÂì |
PDF |
191KB |
|
¡@ |
Ni-1¥b¥úÂì |
PDF |
132KB |
|
¡@ |
¥ú¿A¿ü |
PDF |
103KB |
|
¡@ |
¥ú¿A¿ü¹] |
PDF |
123KB |
|
¡@ |
Ni-2¥úÂì |
PDF |
132KB |
|
¡@ |
¬~¼Ñ¾¯ |
PDF |
137KB |
|
¡@ |
°ª³tª÷ |
PDF |
129KB |
|
¡@ |
°ª³tÂìNi-3 |
PDF |
128KB |
|
¡@ |
³nª÷ |
PDF |
131KB |
|
¡@ |
µwª÷ |
PDF |
130KB |
|
Conditioner |
½Õ¾ã¾¯¡]Conditioner¡^ |
PDF |
113KB |
|
HL-420 |
Âù²G«¬é¿ü¹]²G |
PDF |
165KB |
|